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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/12/2022
Application #:
16940258
Filing Dt:
07/27/2020
Publication #:
Pub Dt:
11/12/2020
Inventors:
Chun-Chieh LU, Ling-Yen YEH, Cheng-Yi PENG, Meng-Hsuan HSIAO, Carlos H. DIAZ et al
Title:
METHOD FOR FORMING INTEGRATED SEMICONDUCTOR DEVICE WITH 2D MATERIAL LAYER
Assignment: 1
Reel/Frame:
053339/0927Recorded: 07/29/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/30/2018
Exec Dt:
08/30/2018
Exec Dt:
08/30/2018
Exec Dt:
09/08/2018
Exec Dt:
08/29/2018
Exec Dt:
08/30/2018
Assignee:
NO.8, LI-HSIN RD.6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
R. BURNS ISRAELSEN
MASCHOFF BRENNAN
1389 CENTER DRIVE, SUITE 300
PARK CITY, UT 84098

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