Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2022
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Application #:
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17028878
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Filing Dt:
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09/22/2020
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Publication #:
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Pub Dt:
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08/05/2021
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Inventors:
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David Y. Wang, Shankar Krishnan, Johannes D. de Veer
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Title:
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OVERLAY METROLOGY ON BONDED WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE TECHNOLOGY DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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| MATTHEW POULSEN, PHD. |
| SUITER SWANTZ INTELLECTUAL PROPERTY |
| 14301 FNB PARKWAY, SUITE 220 |
| OMAHA, NE 68154 |
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