Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2022
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Application #:
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16783132
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Filing Dt:
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02/05/2020
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Publication #:
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Pub Dt:
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08/05/2021
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Inventors:
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Zhitao Cao, Jun Zhai, Sanjay Dabral, Kunzhong Hu
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Title:
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HIGH DENSITY 3D INTERCONNECT CONFIGURATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE APPLE PARK WAY |
| CUPERTINO, CALIFORNIA 95014 |
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| APPLE-J /JAFFERY WATSON MENDONSA & HAMIL |
| 7501 VILLAGE SQUARE DRIVE |
| SUITE 206 |
| CASTLE ROCK, CO 80108 |
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