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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/19/2022
Application #:
16474266
Filing Dt:
06/27/2019
Publication #:
Pub Dt:
04/23/2020
Inventors:
Su Jin KIM, Pum Suk PARK, Dong Sik KIM, Il Ha LEE, Hyungju OH, Byung Kyu LIM et al
Title:
THERMOELECTRIC MODULE
Assignment: 1
Reel/Frame:
049626/0445Recorded: 06/28/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/10/2019
Exec Dt:
06/10/2019
Exec Dt:
06/03/2019
Exec Dt:
06/06/2019
Exec Dt:
06/03/2019
Exec Dt:
05/31/2019
Exec Dt:
05/31/2019
Exec Dt:
05/31/2019
Assignee:
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD
SUITE 100E
FALLS CHURCH, VA 22042

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