Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/03/2022
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Application #:
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17280185
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Filing Dt:
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03/26/2021
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Publication #:
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Pub Dt:
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10/21/2021
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Inventors:
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Teru SAKAKIBARA, Shinya KOMABIKI, Koji MAEDA, Hidehiko KARASAKI
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Title:
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METHOD FOR FABRICATING SEMICONDUCTOR DEVICE CHIPS AND PROTECTIVE COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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58, IJIRI, ISEDA-CHO, UJI-SHI |
KYOTO, JAPAN 6110043 |
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1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI |
OSAKA, JAPAN 5406207 |
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HAUPTMAN HAM LLP |
2318 MILL ROAD, SUITE 1400 |
ALEXANDRIA, VA 22314 |
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05/08/2024 11:37 PM
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