Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2022
|
Application #:
|
16912595
|
Filing Dt:
|
06/25/2020
|
|
Publication #:
|
|
Pub Dt:
|
02/25/2021
| | | | |
|
Inventors:
|
Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh
|
|
Title:
|
TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEGRATED-CIRCUIT PACKAGES
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
|
|
|
|
| SCHWEGMAN, LUNDBERG & WOESSNER/INTEL |
| PO BOX 2938 |
| MINNEAPOLIS, MN 55402 |
|
|
Search Results as of:
05/21/2024 02:41 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
