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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/10/2022
Application #:
17168030
Filing Dt:
02/04/2021
Publication #:
Pub Dt:
09/02/2021
Inventors:
Kun Jiang, Yahong Xiong, Da Jin, Junguo Cui
Title:
POWER MODULE STRUCTURE AND ASSEMBLING METHOD THEREOF
Assignment: 1
Reel/Frame:
055155/0153Recorded: 02/04/2021Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Assignee:
31-1 XINGBANG ROAD, GUISHAN INDUSTRIAL ZONE
TAOYUAN CITY, TAIWAN 33370
Correspondent:
EVAN R. WITT KIRTON & MCCONKIE
36 SOUTH STATE STREET, SUITE 1900
SALT LAKE CITY, UT 84111

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