Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2022
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Application #:
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17010990
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Filing Dt:
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09/03/2020
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Publication #:
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Pub Dt:
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01/14/2021
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Inventors:
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Klaus Wilke, Minoru Ueshima, Hans-Jurgen Albrecht, Katsuaki Suganuma
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Title:
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Solder Alloy for Power Devices and Solder Joint Having a High Current Density
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23, SENJU-HASHIDO-CHO, ADACHI-KU |
TOKYO, JAPAN 120-8555 |
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THE WEBB LAW FIRM |
ONE GATEWAY CENTER |
420 FT. DUQUESNE BLVD, SUITE 1200 |
PITTSBURGH, PA 15222 |
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05/09/2024 07:25 PM
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