Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/24/2022
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Application #:
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16981769
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Filing Dt:
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09/17/2020
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Publication #:
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Pub Dt:
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04/22/2021
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Inventors:
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Minoru SASAKI, Hironori OGAWA, Akira DOI, Masaki HASEGAWA, Tomohiko OGATA, Yuko OKADA
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Title:
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WAFER INSPECTION APPARATUS AND WAFER INSPECTION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 17-1, TORANOMON 1-CHOME, MINATO-KU, |
| TOKYO, JAPAN 1056409 |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD |
| SUITE 210 |
| ALEXANDRIA, VA 22314 |
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