Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/24/2022
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Application #:
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16067120
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Filing Dt:
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06/28/2018
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Publication #:
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Pub Dt:
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12/27/2018
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Inventors:
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Takumi OHKABE, Takashi YAMADA, Tomohiro UNO, Daizo ODA, Teruo HAIBARA, Tetsuya OYAMADA
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICES
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 158-1, OAZA SAYAMAGAHARA |
| IRUMA-SHI, SAITAMA, JAPAN 358-0032 |
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| 7-16-3, GINZA, CHUO-KU |
| TOKYO, JAPAN 104-0061 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
3
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CHANGE OF ADDRESS FOR NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
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| 13-1, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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