Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2022
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Application #:
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17165125
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Filing Dt:
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02/02/2021
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Publication #:
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Pub Dt:
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06/23/2022
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Inventors:
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YUEH-MING TUNG, CHIA-MING YANG, JUNG-WEI CHEN, JIAN-DE LEU, GUAN-LIN PAN
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 9, CENTRAL 3RD ST. |
| NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE, SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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