Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2022
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Application #:
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16987991
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Filing Dt:
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08/07/2020
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Publication #:
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Pub Dt:
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02/10/2022
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Inventors:
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Yiping Wang, Jordan D. Greenlee, Collin Howder
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Title:
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Conductive Via Of Integrated Circuitry, Memory Array Comprising Strings Of Memory Cells, Method Of Forming A Conductive Via Of Integrated Circuitry, And Method Of Forming A Memory Array Comprising Strings Of Memory Cells
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY, MS 1- 525 |
| BOISE, IDAHO 83716 |
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| WELLS ST. JOHN P.S. |
| 601 W. MAIN AVENUE |
| SUITE 600 |
| SPOKANE, WA 99201 |
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