Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2022
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Application #:
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17012198
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Filing Dt:
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09/04/2020
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Publication #:
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Pub Dt:
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03/11/2021
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Inventors:
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Ralf Otremba, Lee Shuang Wang, Teck Sim Lee, Mohd Hasrul Zulkifli
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Title:
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Multi-Chip Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 1255 CRESCENT GREEN |
| SUITE 200 |
| CARY, NC 27518 |
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