Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2022
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Application #:
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16356316
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Filing Dt:
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03/18/2019
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Publication #:
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Pub Dt:
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09/24/2020
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Inventors:
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Ashutosh Baheti, Marwa Abdel-Aziz, Mustafa Dogan, Muhammad Tayyab Qureshi et al
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Title:
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Integration of EBG Structures (Single Layer/Multi-Layer) for Isolation Enhancement In Multilayer Embedded Packaging Technology at mmWave
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| SLATER MATSIL, LLP/INFINEON |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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