Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/07/2022
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Application #:
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17088088
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Filing Dt:
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11/03/2020
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Publication #:
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Pub Dt:
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02/18/2021
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Inventors:
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Fei YE, Fei XU, Lei SHI
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Title:
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MULTI-LEVEL INVERTER CLAMPING MODULATION METHOD AND APPARATUS, AND INVERTER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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| WOMBLE BOND DICKINSON (US) LLP /HUAWEI A |
| P.O. BOX 7037 |
| ATLANTA, GA 30357-0037 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OFFICE 01, 39TH FLOOR, BLOCK A |
| ANTUOSHAN HEADQUARTERS TOWERS, 33 ANTUOSHAN 6TH ROAD, FUTIAN DISTRICT |
| SHENZHEN, CHINA 518043 |
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| HUAWEI TECHNOLOGIES CO., LTD. |
| BUILDING G1-2, HUAWEI INDUSTRIAL BASE, |
| BANTIAN,LONGGANG DISTRICT |
| SHENZHEN, 518129 CHINA |
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