Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2022
|
Application #:
|
16654187
|
Filing Dt:
|
10/16/2019
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2021
| | | | |
|
Inventors:
|
Po-Hao TSAI, Yi-Wen WU, Shin-Puu JENG, Meng-Liang LIN, Po-Yao CHUANG, Techi WONG
|
|
Title:
|
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT FEATURE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE SE |
| SUITE 550 |
| ATLANTA, GA 30339 |
|
|
Search Results as of:
05/14/2024 11:24 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
