Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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16510448
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Filing Dt:
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07/12/2019
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Publication #:
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Pub Dt:
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01/14/2021
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Inventors:
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Meng How Chong, Chee Ming Lam, Arivindran Navaretnasinggam, Lee Shuang Wang et al
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Title:
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Package Lead Design with Grooves for Improved Dambar Separation
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 1255 CRESCENT GREEN |
| SUITE 200 |
| CARY, NC 27518 |
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05/10/2024 01:41 AM
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