Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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17203673
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Filing Dt:
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03/16/2021
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Publication #:
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Pub Dt:
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07/01/2021
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Inventors:
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Mingzhu WANG, Zhenyu CHEN, Nan GUO, Takehiko Tanaka, Bojie ZHAO, Zilong DENG
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Title:
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Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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66-68 SHUNYU ROAD, |
YUYAO CITY, NINGBO, ZHEJIANG PROVINCE, CHINA 315400 |
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RAYMOND Y CHAN |
108 N. YNEZ AVE., SUITE 128 |
MONTEREY PARK, CA 91754 |
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05/02/2024 08:45 PM
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