Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/21/2022
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Application #:
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16619272
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Filing Dt:
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12/04/2019
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Inventors:
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Koichi Nishimura, Sergio Ishiba, Hitoshi Uruga, Hisayoshi Aoki, Yosuke Kondo et al
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Title:
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Seamless Capsule Shell Composition and Seamless Capsule
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4242-1, KITAYAMA, FUJINOMIYA-SHI |
SHIZUOKA, JAPAN 4180112 |
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1-7-10, DOSHOMACHI, CHUO-KU |
OSAKA-SHI |
OSAKA, JAPAN 5410045 |
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LAURA DACONCEICAO |
CHALKER FLORES, LLP |
14951 NORTH DALLAS PARKWAY, SUITE 400 |
DALLAS, TX 75254 |
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05/02/2024 07:31 AM
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