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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/28/2022
Application #:
17475510
Filing Dt:
09/15/2021
Inventor:
Min Jae Lee
Title:
THERMOELECTRIC MODULE
Assignment: 1
Reel/Frame:
057484/0812Recorded: 09/15/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/06/2021
Assignees:
12, HEOLLEUNG-RO, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF 06797
12, HEOLLEUNG-RO, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF 06797
Correspondent:
JERE VALLES/MORGAN, LEWIS & BOCKIUS LLP (SF)
ONE MARKET, SPEAR STREET TOWER
SAN FRANCISCO, CA 94105

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