Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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16895186
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Filing Dt:
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06/08/2020
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Publication #:
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Pub Dt:
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12/10/2020
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Inventors:
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Minoru MATSUZAWA, Yoshiaki YODO, Masamitsu AGARI, Yusuke FUJII, Makiko OHMAE et al
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Title:
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WAFER PROCESSING METHOD INCLUDING UNITING A WAFER, A RING FRAME AND A POLYESTER SHEET WITHOUT USING AN ADHESIVE LAYER
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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13-11, OMORI-KITA 2-CHOME, OTA-KU, |
TOKYO, JAPAN 143-8580 |
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GREER, BURNS & CRAIN, LTD |
300 S. WACKER DR. |
SUITE 2500 |
CHICAGO, IL 60606 |
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