Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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16932726
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Filing Dt:
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07/18/2020
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Publication #:
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Pub Dt:
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01/21/2021
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Inventors:
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EUNJI KIM, SUNGDONG CHO, KWANGWUK PARK, SANGJUN PARK, DAESUK LEE, HAKSEUNG LEE
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Title:
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SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE WITH HEAD AND BODY PORTIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| F. CHAU & ASSOCIATES, LLC |
| 130 WOODBURY ROAD |
| WOODBURY, NY 11797 |
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