Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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17012075
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Filing Dt:
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09/04/2020
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Publication #:
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Pub Dt:
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11/18/2021
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Inventor:
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Chung Hsing Tzu
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Title:
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MULTI-SIDED COOLING SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 7, GONGYE E. 7TH RD., EAST DIST., |
| HSINCHU CITY, TAIWAN 300 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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Assignment:
2
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MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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Newly Merged Entity's New Name:
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| 7F., NO. 50, MINQUAN RD., XINDIAN DIST., |
| NEW TAIPEI CITY, TAIWAN |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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