Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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16498010
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Filing Dt:
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09/26/2019
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Publication #:
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Pub Dt:
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11/25/2021
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Inventors:
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Nobuaki Miyamoto, Atsushi Miki
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Title:
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Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8164 |
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| NIELDS, LEMACK & FRAME, LLC |
| 176 E. MAIN STREET |
| SUITE #5 |
| WESTBOROUGH, MA 01581 |
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