Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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16619343
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Filing Dt:
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12/04/2019
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Publication #:
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Pub Dt:
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04/16/2020
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Inventors:
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Ryosuke Yamazaki, Shinichi Yamamoto
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Title:
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CURABLE SILICONE COMPOSITION FOR DIE BONDING USE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, OTEMACHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-0004 |
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| DAVID M. LAPRAIRIE |
| HOWARD & HOWARD ATTORNEYS PLLC |
| 450 WEST FOURTH STREET |
| ROYAL OAK, MI 48067 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 11-1, NAGATA-CHO 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| DAVID M. LAPRAIRIE |
| HOWARD & HOWARD ATTORNEYS PLLC |
| 450 WEST 4TH STREET |
| ROYAL OAK, MI 48067 |
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