Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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16857446
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Filing Dt:
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04/24/2020
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Publication #:
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Pub Dt:
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08/06/2020
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Inventors:
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Yao-Yuan SHANG, Yen-Yu CHEN, Yi-Ming DAI, Powen HUANG, Kuo-Shu TSENG, Chun-Chih LIN
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Title:
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METROLOGY METHOD IN WAFER TRANSPORTATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE SE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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