Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/19/2022
|
Application #:
|
17059084
|
Filing Dt:
|
11/25/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2021
| | | | |
|
Inventors:
|
Huiying DING, Junfeng LIU, Longnan JIN, Heinrich KARRER, Thomas SCHMIDT
|
|
Title:
|
PACKAGING PROCESS FOR PLATING WITH SELECTIVE MOLDING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 63 LANCASTER AVENUE |
| MALVERN, PENNSYLVANIA 19355 |
|
|
|
|
| RYAN W. O'DONNELL |
| VOLPE KOENIG |
| 30 SOUTH 17TH STREET, 18TH FLOOR |
| PHILADELPHIA, PA 19103 |
|
|
Search Results as of:
05/13/2024 12:28 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
