Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/19/2022
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Application #:
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16909290
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Filing Dt:
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06/23/2020
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Publication #:
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Pub Dt:
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10/08/2020
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Inventors:
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Mingzhu WANG, Nan GUO, Zhenyu CHEN, Bojie ZHAO, Takehiko TANAKA, Feifan CHEN, Ye WU
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Title:
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MANUFACTURE OF SEMICONDUCTOR MODULE WITH DUAL MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66-68 SHUNYU ROAD |
| YUYAO CITY, NINGBO, ZHEJIANG, CHINA 315400 |
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| JESSICA L. GODISH |
| PANITCH SCHWARZE BELISARIO & NADEL LLP |
| TWO COMMERCE SQUARE, 2001 MARKET ST., SUITE 2800 |
| PHILADELPHIA, PA 19103 |
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