Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/26/2022
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Application #:
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17125526
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Filing Dt:
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12/17/2020
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Publication #:
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Pub Dt:
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06/02/2022
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Inventors:
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WEI-LIANG WU, JIA-HE LI
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Title:
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METHOD FOR MANUFACTURING CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| B1DG A1-A3, AVARY PARK, SONGLUO RD.,,YANCHUAN COMMUNITY, YANLUO ST., BAO AN DIST., |
| SHENZHEN, CHINA |
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| NO. 8, PENGDING ROAD, HUAI AN CITY,JIANGSU PROVINCE, CHINA |
| HUAI AN, CHINA |
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| 8F., NO. 8, BAOQIANG RD., XIXDIAN DIST.,,NEW TAIPEI CITY 23144,TAIWAN (R.O.C.) |
| NEW TAIPEI, TAIWAN |
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| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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