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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/09/2022
Application #:
17223175
Filing Dt:
04/06/2021
Publication #:
Pub Dt:
01/13/2022
Inventor:
Hiroyuki Ishii
Title:
SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
055844/0440Recorded: 04/06/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/24/2021
Assignee:
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588
Correspondent:
WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
8500 LEESBURG PIKE
SUITE 7500
TYSONS, VA 22182

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