Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2022
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Application #:
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16896348
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Filing Dt:
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06/09/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Inventors:
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Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao et al
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Title:
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HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & POTASHNIK LLC |
| 629 EUCLID AVE. |
| SUITE 1000 |
| CLEVELAND, OH 44114 |
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