Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/16/2022
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Application #:
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15706781
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Filing Dt:
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09/18/2017
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Publication #:
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Pub Dt:
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03/21/2019
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Inventor:
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Ming-Yen Chiu
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Title:
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PACKAGE STRUCTURE HAVING INTEGRATED CIRCUIT COMPONENT WITH CONDUCTIVE TERMINALS OF DIFFERENT DIMENSIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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