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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/06/2022
Application #:
17037858
Filing Dt:
09/30/2020
Publication #:
Pub Dt:
03/31/2022
Inventors:
YU-CHOU LIN, CHIEN-HSIU HUANG, TECK-CHAI GOH
Title:
OPTICAL SENSOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
Assignment: 1
Reel/Frame:
053927/0764Recorded: 09/30/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/24/2020
Exec Dt:
04/24/2020
Exec Dt:
05/03/2020
Assignee:
151 LORONG CHUAN, #03-03, NEW TECH PARK,
SINGAPORE, SINGAPORE 556741
Correspondent:
LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
3057 NUTLEY STREET
SUITE 818
FAIRFAX, VA 22031

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