Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/13/2022
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Application #:
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16855375
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Filing Dt:
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04/22/2020
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Publication #:
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Pub Dt:
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08/06/2020
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Inventors:
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Kazumasa SAKURAI, Kazuya WAKITA, Yuuji KAKUYA
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Title:
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AN INTERLAYER REGION HAVING A SIGNAL VIA FOR COUPLING BETWEEN PLANAR SIGNAL LINES, WHERE A MULTI-MODE SIGNAL PROPAGATES THROUGH THE INTERLAYER REGION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 500-20, MINAMIYAMA, KOMENOKI-CHO |
| NISSHIN-CITY, AICHI-PREF., JAPAN 470-0111 |
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| 1-1 SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| ANDREW D. LEE |
| 1389 CENTER DRIVE |
| STE. 300 |
| PARK CITY, UT 84098 |
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