Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/27/2022
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Application #:
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16100406
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Filing Dt:
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08/10/2018
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Publication #:
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Pub Dt:
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02/13/2020
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Inventors:
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Je-Young Chang, Shankar Devasenathipathy, Chandra Mohan Jha, Zhimin Wan, Chia-Pin Chiu et al
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Title:
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THERMAL ASSEMBLIES FOR MULTI-CHIP PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| LAURA A. ZAGER |
| 2816 LAGO VISTA LANE |
| PATENT CAPITAL GROUP |
| ROCKWALL, TX 75032 |
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