Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/04/2022
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Application #:
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16521727
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Filing Dt:
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07/25/2019
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Publication #:
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Pub Dt:
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01/28/2021
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Inventors:
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Dror Hurwitz, BawChing Perng, Duan Feng
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Title:
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Method for Packaging an Electronic Component in a Package with an Organic Back End
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| #297, ROOM 110, BUILD 18, INNOVATION VALLEY |
| NO.1889, HUANDAO EASTERN ROAD, HENGQIN |
| ZHUHAI, GUANGDONG, CHINA 519000 |
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| GREGORY S. ROSENBLATT |
| WIGGIN AND DANA LLP |
| ONE CENTURY TOWER, 265 CHURCH STREET |
| NEW HAVEN, CT 06510 |
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