Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
10/11/2022
|
Application #:
|
15500740
|
Filing Dt:
|
01/31/2017
|
Publication #:
|
|
Pub Dt:
|
08/03/2017
| | | | |
Inventors:
|
Takahiro HATTORI, Ken TACHIBANA
|
Title:
|
Solder Alloy, Solder Ball, Chip Solder, Solder Paste and Solder Joint
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
23, SENJU-HASHIDO-CHO, ADACHI-KU |
TOKYO, JAPAN 120-8555 |
|
|
|
THE WEBB LAW FIRM, P.C. |
ONE GATEWAY CENTER |
420 FT. DUQUESNE BLVD, SUITE 1200 |
PITTSBURGH, PA 15222 |
|
|
Search Results as of:
05/06/2024 12:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|