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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11470739
Issue Dt:
10/11/2022
Application #:
17354781
Filing Dt:
06/22/2021
Publication #:
20210321535
Pub Dt:
10/14/2021
Inventors:
David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
Title:
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING
Assignment: 1
Reel/Frame:
058965/0920Recorded: 12/16/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
AMOS, DAVID
Exec Dt:
03/03/2020
EDMUNDS, NEIL
Exec Dt:
03/04/2020
YOUNG, ANDREW
Exec Dt:
03/09/2020
KIDGER, JASPER
Exec Dt:
03/03/2020
LONGHURST, NATHAN
Exec Dt:
03/02/2020
Assignee:
ICEOTOPE GROUP LIMITED
AMP TECHNOLOGY CENTRE
BRUNEL WAY, ROTHERHAM
SOUTH YORKSHIRE, UNITED KINGDOM S60 5WG
Correspondent:
BUTZEL LONG / 030120
1909 K ST.
SUITE 500
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
064310/0057Recorded: 07/19/2023Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MOON, GYEONG UB
Exec Dt:
06/07/2023
KIM, CHUL
Exec Dt:
06/07/2023
AN, JONGYEOP
Exec Dt:
06/07/2023
LEE, HYEON JUN
Exec Dt:
06/07/2023
CHOI, BORAM
Exec Dt:
06/07/2023
Assignee:
SAMSUNG DISPLAY CO., LTD.
1, SAMSUNG-RO, GIHEUNG-GU
YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 17113
Correspondent:
F. CHAU & ASSOCIATES, LLC
130 WOODBURY ROAD
WOODBURY, NY 11797

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