Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/25/2022
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Application #:
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16324893
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Filing Dt:
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02/11/2019
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Publication #:
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Pub Dt:
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04/23/2020
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Inventors:
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Shaoming ZHANG, Xixue LIU, Zhigang WANG, Ning AN, Huijun HE, Yanbin SUN, Qiang HU et al
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Title:
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SnBiSb Series Low-temperature Lead-free Solder and its Preparation Method
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6# LEYUAN STEET, YANQI DEVELOPMENT AREA, HUAIROU DISTRICT BEIJING 101407, CN |
BEIJING, CHINA 101407 |
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GOKALP BAYRAMOGLU |
1540 W. WARM SPRINGS ROAD SUITE 100 |
HENDERSON, NV 89014 |
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