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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/01/2022
Application #:
17542539
Filing Dt:
12/06/2021
Inventors:
Dongya Sun, Yuechan Li, Liang Yang, An Xie, Chunyan Cao, Xiangjun Lu
Title:
Liquid Mixture for Filling Blind Holes in Copper Foil
Assignment: 1
Reel/Frame:
058290/0255Recorded: 12/06/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/06/2021
Exec Dt:
12/06/2021
Exec Dt:
12/06/2021
Exec Dt:
12/06/2021
Exec Dt:
12/06/2021
Exec Dt:
12/06/2021
Assignee:
600 LIGONG ROAD, JIMEI DISTRICT,
XIAMEN, CHINA 361024
Correspondent:
IPEXPER
POBOX 151
MILLBURN, 07041 UNITED STATES

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