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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/01/2022
Application #:
17158382
Filing Dt:
01/26/2021
Publication #:
Pub Dt:
08/19/2021
Inventors:
Seiji Samukawa, Kenta Sugawara, Daisuke Ohori
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
055032/0328Recorded: 01/26/2021Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/07/2021
Exec Dt:
01/12/2021
Exec Dt:
01/12/2021
Assignees:
5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI,
OSAKA, JAPAN 541-0041
2-1-1, KATAHIRA, AOBA-KU, SENDAI-SHI,
MIYAGI, JAPAN 980-8577
Correspondent:
IPUSA, P.L.L.C
1054 31ST STREET, N.W.
SUITE 400
WASHINGTON, DC 20007

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