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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/15/2022
Application #:
16936042
Filing Dt:
07/22/2020
Publication #:
Pub Dt:
02/04/2021
Inventors:
Jian Li, Zheng John Ye, Shailendra Srivastava, Deenesh Padhi, Chuan Ying Wang et al
Title:
SEMICONDUCTOR SUBSTRATE SUPPORTS WITH IMPROVED HIGH TEMPERATURE CHUCKING
Assignment: 1
Reel/Frame:
055202/0461Recorded: 02/09/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/04/2020
Exec Dt:
10/28/2020
Exec Dt:
11/04/2020
Exec Dt:
10/28/2020
Exec Dt:
10/28/2020
Exec Dt:
10/28/2020
Exec Dt:
11/29/2020
Exec Dt:
10/28/2020
Exec Dt:
10/28/2020
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
KILPATRICK TOWNSEND & STOCKTON LLP
1100 PEACHTREE STREET, SUITE 2800
ATLANTA, GA 30309

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