Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/15/2022
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Application #:
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16752863
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Filing Dt:
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01/27/2020
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Publication #:
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Pub Dt:
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09/10/2020
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Inventors:
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Shigenobu TOCHIYAMA, Yuhei NAGASHIMA, Masayoshi TAMURA
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Title:
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HEATSINK, AND SEMICONDUCTOR MODULE INCLUDING THE HEATSINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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| SUGHRUE MION, PLLC |
| 2000 PENNSYLVANIA AVENUE, N.W. |
| SUITE 900 |
| WASHINGTON, DC 20006 |
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