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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/15/2022
Application #:
17319451
Filing Dt:
05/13/2021
Publication #:
Pub Dt:
09/02/2021
Inventors:
Selaka B. Bulumulla, Koushik Ramachandran, Benjamin V. Fasano
Title:
MICROELECTRONICS PACKAGE WITH ULTRA-LOW-K DIELECTRIC REGION BETWEEN STACKED ANTENNA ELEMENTS
Assignment: 1
Reel/Frame:
056231/0399Recorded: 05/13/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/27/2020
Exec Dt:
02/27/2020
Exec Dt:
02/27/2020
Assignee:
400 STONEBREAK ROAD EXTENSION
MALTA, NEW YORK 12020
Correspondent:
GIBB & RILEY, LLC
550M RITCHIE HIGHWAY, #286
SEVERNA PARK, MD 21146

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