Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/15/2022
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Application #:
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16413356
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Filing Dt:
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05/15/2019
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Publication #:
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Pub Dt:
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08/29/2019
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Inventors:
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Kouhei KURIMOTO, Rinzo KAYANO, Shoji KAKIO, Kazuhito KISHIDA, Jun MIZUNO
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Title:
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METHOD OF MANUFACTURING BONDED SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| 104 TOTSUKAMACHI 1-CHOME |
| SHINJUKU-KU |
| TOKYO, JAPAN 169-8050 |
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| 4-4-37, TAKEDA |
| KOFU-SHI |
| YAMANASHI, JAPAN 400-8510 |
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| HOLTZ, HOLTZ & VOLEK PC |
| 630 NINTH AVENUE |
| SUITE 1010 |
| NEW YORK, NY 10036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME |
| SHIGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| HOLTZ, HOLTZ & VOLEK PC |
| 630 NINTH AVENUE |
| SUITE 1010 |
| NEW YORK, NY 10036 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE INTERNAL ADDRESS PREVIOUSLY RECORDED AT REEL: 051304 FRAME: 0248. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| HOLTZ, HOLTZ & VOLEK PC |
| 630 NINTH AVENUE |
| SUITE 1010 |
| NEW YORK, NY 10036 |
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05/04/2024 09:43 PM
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