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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/29/2022
Application #:
17264792
Filing Dt:
01/29/2021
Publication #:
Pub Dt:
09/23/2021
Inventors:
Gongyue TANG, Kazunori YAMAMOTO, Xiaowu ZHANG
Title:
A PLURALITY OF HEAT SINKS FOR A SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
056747/0369Recorded: 07/02/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/27/2021
Exec Dt:
04/27/2021
Exec Dt:
04/27/2021
Assignee:
1 FUSIONOPOLIS WAY
#20-10 CONNEXIS
SINGAPORE, SINGAPORE 138632
Correspondent:
WOMBLE BOND DICKINSON (US) LLP
ATTN: IP DOCKETING
P.O. BOX 7037
ATLANTA, GA 30357

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