Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17108201
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Filing Dt:
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12/01/2020
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Publication #:
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Pub Dt:
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03/25/2021
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Inventors:
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You-Hsien LIN, Chih-Wei CHANG
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Title:
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THROUGH-SILICON VIA CRACK DETECTING APPARATUS, DETECTING METHOD, AND SEMICONDUCTOR DEVICE FABRICATION METHOD HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 388, XINGYE AVENUE |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI, ANHUI, CHINA |
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| SHEPPARD MULLIN RICHTER & HAMPTON LLP |
| 379 LYTTON AVE. |
| ATTN: JING ZHENG |
| PALO ALTO, CA 94301 |
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