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Patent Assignment Abstract of Title
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Total Assignments: 4
Patent #:
11532588
Issue Dt:
12/20/2022
Application #:
17153993
Filing Dt:
01/21/2021
Publication #:
20210143121
Pub Dt:
05/13/2021
Inventors:
Hideo NAKAKO, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
Title:
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
054980/0750Recorded: 01/21/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NAKAKO, HIDEO
Exec Dt:
07/25/2019
KURAFUCHI, KAZUHIKO
Exec Dt:
08/08/2019
EJIRI, YOSHINORI
Exec Dt:
07/25/2019
ISHIKAWA, DAI
Exec Dt:
07/25/2019
SUGAMA, CHIE
Exec Dt:
07/25/2019
KAWANA, YUKI
Exec Dt:
07/25/2019
Assignee:
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-6606
Correspondent:
ALAN E. SCHIAVELLI
1250 23RD STREET NW, SUITE 410
WASHINGTON, DC 20037-1164
Assignment: 2
Reel/Frame:
055056/0360Recorded: 01/21/2021Pages: 52
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
HITACHI CHEMICAL COMPANY, LTD.
Exec Dt:
10/01/2020
Assignee:
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-6606
Correspondent:
ALAN E. SCHIAVELLI
1250 23RD STREET NW, SUITE 410
WASHINGTON, DC 20037-1164
Assignment: 3
Reel/Frame:
062992/0805Recorded: 03/08/2023Pages: 15
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
SHOWA DENKO MATERIALS CO., LTD.
Exec Dt:
01/01/2023
Assignee:
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-8518
Correspondent:
ALAN E. SCHIAVELLI
700 12TH STREET NW, SUITE 700
WASHINGTON, DC 20005
Assignment: 4
Reel/Frame:
066599/0037Recorded: 02/14/2024Pages: 40
Conveyance:
CHANGE OF ADDRESS
Assignor:
RESONAC CORPORATION
Exec Dt:
10/01/2023
Assignee:
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME
MINATO-KU
TOKYO, JAPAN 105-7325
Correspondent:
ALAN E. SCHIAVELLI
SUITE 2100
120 SOUTH LASALLE STREET
CHICAGO, IL 60603

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