Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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16633436
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Filing Dt:
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04/09/2020
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Publication #:
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Pub Dt:
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08/26/2021
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Inventors:
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Toyohiko FUJISAWA, Kenji OTA
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Title:
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MULTICOMPONENT-CURABLE THERMALLY-CONDUCTIVE SILICONE GEL COMPOSITION, THERMALLY-CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-24, HIGASHI-SHINAGAWA 2-CHOME |
SHINAGAWA-KU, TOKYO, JAPAN 1408617 |
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WARNER NORCROSS + JUDD LLP INTELLECTUAL |
1500 WARNER BUILDING |
150 OTTAWA AVE NW |
GRAND RAPIDS, MI 49503-2487 |
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