Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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17014363
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Filing Dt:
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09/08/2020
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Inventors:
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Scott A. Whalen, Tianhao Wang, Piyush Upadhyay, Keerti S. Kappagantula
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Title:
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Assemblies, Riveted Assemblies, Methods for Affixing Substrates, and Methods for Mixing Materials to Form a Metallurgical Bond
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 999 |
| DEPT. K1-53 |
| RICHLAND, WASHINGTON 99352 |
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| ROBERT C. HYTA |
| 601 W. MAIN AVENUE |
| SUITE 600 |
| SPOKANE, MT 99201 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 1000 INDEPENDENCE AVE., SW |
| WASHINGTON, DISTRICT OF COLUMBIA 20585 |
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| BRENDA K. BANKS |
| 1000 INDEPENDENCE AVE. |
| WASHINGTON, DC 20585 |
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